Sr. Principal Process Engineer - MEMS Electrodeposition
This position will be responsible for the development, implementation, and continuous improvement of various advanced electrochemical processes used to manufacture advanced MEMS-based probe cards.
Primary job responsibilities
Unit process development (including new plating chemistry evaluation), new design setup and new technology introduction.
Drive the ramp and scale-up of new deposition processes from prototype to high volume manufacturing in our state of the art MEMS fabrication facility.
Support the specification, evaluation and qualification of advanced electrodeposition tooling to improve process capabilities.
Troubleshooting, and overall process sustaining activities for MEMS electrochemical processes will be a part of the role.
Daily activities will include
Analysis of data from production and engineering process runs, qualifying changes or additions to manufacturing toolsets and process flows, and designing and executing engineering experiments to either resolve process excursions or to drive process performance improvements.
General responsibilities may include
Managing the activities of 1 or more process technicians.
Statistical methods is required to establish robust process controls and healthy process capabilities, analyze process yield, and for experimental design and analysis.
Lead cross-functional projects to successfully solve complex unit process and/or integration challenges.
Requirements:
BS or MS in Chemical Engineering or Material Science
5+ years experience work in a Process Engineering group
Blanced and in-depth understanding of both the process physics and the underlying chemistry required to achieve a highly stable and predictive process.
Strong statistical anaysis and use of methods is required.
Solid leadership of cross-functional projects
Company Description:
FormFactor, Inc. designs, develops, manufactures, sells, and supports precision and high performance advanced semiconductor wafer probe cards. Its wafer probe cards are used to perform wafer sort and test on the semiconductor dies, chips, or the semiconductor wafers. The company’s world-wide customer base uses its wafer probe cards to test DRAM chips, including DDR3, SDRAM, mobile DRAM, graphic DRAM, NOR and NAND flash memory chips, serial data devices, chipsets, microprocessors, microcontrollers, and analog devices. The company’s MEMS-based contactors are fabricated using advanced lithographic, thin-film, and electrodeposition methods. The company was founded in 1993 and is headquartered in Livermore, California
